Bi-Metal Bonding Plate
Product Information
Product Variations
| Product No. | Material | Box Qty. | Approx. Box Wt. (lbs.) | Documents | |
|---|---|---|---|---|---|
| BMBP | Aluminum/Brass | 5 | 3.75 | 
|
• Allows copper conductors to be bonded to aluminum surfaces.
• Provides over 8 square inches of bonding surface.
• Aluminum - Dual cable pressure connector accepts all aluminum main size conductors up to .56" diameter.
• Copper - Dual bolt connector accepts all copper main size conductors up to .50" in diameter.
• Recommended installation tool - 1/2" socket wrench, end wrench or nut driver.
• A bonding plate shall have a minimum thickness of not less than 3/32 inch (2.4 mm). The thickness shall not be less than 5/16 inch (7.9 mm) for bosses for screw threads.*
• A Class I bonding plate shall have a minimum surface contact area of 3 square inches (19.4 cm2).*
• A Class II bonding plate shall comply with the material and dimensional requirements for Class I bonding plates.
• A bonding plate for utilizing the steel framework as a conductor shall have a surface contact area of not less than 8 square inches (52 cm2).